IS680 3.45
3.45 Dk , 0.0035 Df
200 Tg , 360 Td
IS680 3.45 laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.
IS680 3.45 is suitable for many of today’s commercial RF/Microwave printed circuit designs. It features a Dielectric Constant (Dk) that is stable between –55°C and + 125°C at up to 20 GHz. In addition, IS680 offers a lower Dissipation Factor (Df) of 0.0035 making it a cost effective alternative to PTFE and other commercial microwave laminate materials.
Key Features
Electrical Properties
- Dk Range 3.45 ± 0.05
- Df Range 0.0030 – 0.0040
- Exceptional dielectric properties over a broad frequency and temperature range perIPCTM-650-2.5.5.5
High Thermal Performance
- Tg of 200°C (DSC)
- Td of 360°C (TGA)
- Low CTE in the Z-axis 2.9% (-55 to 288°C)
Available in laminate
- IS680 offers a complete laminate materials solution for single and double sided printed circuit designs.
Standard Availability
- Thicknesses: 0.020”, 0.030”, 0.060”
- Copper Cladding: ½, 1 and 2 ounce (heavier copper available)
UL File
- 94 V0 File# E41625